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CC3-301AD  

 

 

Thermally Conductive, Low Viscosity Potting Resin

 

 

CC3-301AD is a low viscosity version of CC3-301. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD have shown good resistance to cracking under severe temperature cycling. Unlike CC3-301, the filler used in CC3-301AD may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

 

CC3-301AD meets MIL T-27, Grade 5, Class S; MIL STD. 202.111, FED TEST METHOD STD. 406-2021;

and MIL I-16923, Types C and D.

 

 

TYPICAL APPLICATIONS:

 

Densely packed power supplies, integrated circuits, thick film hybrid devices, D/A converters, delay lines, oscillators, minidac, operational amplifiers, binary devices, relays, transformers and semiconductors.

 

 

ELECTRICAL AND PHYSICAL PROPERTIES:    
  Specific Gravity @ 25’ C 1.9 to 2.1  
  Viscosity @ 25’ C, cps, (catalyzed) 1,500 to 2,000  
  Thermal Conductivity: BTU/ft2/hr/'F/in   8.9  
  Tensile Strength @ 25’ C,  psi   7,800  
  Compressive Strength @ 25’ C, psi 19,000  
  Izod Impact: ft lbs/in of notch  0.49  
  Coefficient of Thermal Expansion: in/in/’C  x  10-6 28  
  Heat Distortion: ‘C 65  
  Water Absorption: %, 7 days @ 25’ C 0.3  
  Volume Resistivity @ 25’ C, ohm-cm  1015  
  Dielectric Constant @ 25’ C, 100 KC 5.6  
  Dissipation Factor @ 25’ C, 100 KC 0.02  
  Dielectric Strength, volts/mil  600  
  Linear Shrinkage: in/in  0.003  
  Service Temperature, ‘C continuous  -65 to +150  
  Standard Color  Black  
 
   
 
( Typical properties when cured with H-7 Hardener )
   

 

 

CC3-301AD

 

 

 

CHOICE OF HARDENERS:

 

H-1 Hardener:                         Rigid, good dimensional stability, fast cure.

 

H-7 Hardener:                         Resilient, excellent mechanical and thermal shock, low viscosity,

good air release, fast cure.

 

Ancamine Z:                           Resilient, excellent mechanical and thermal shock, plus high heat

distortion, long pot life.

 

 

HARDENER

PARTS BY WEIGHT
PER 100 PARTS OF RESIN

POT LIFE
100 GRAM
25'C (77'F)

CURE TIME
25' C
(77'F)

CURE TIME
65' C
(149' F)

CURE TIME
125 ' C
(257 ' F)

H-1 Hardener

5.4

2 hrs.

24 hrs.

2 hrs.

- - -

H-7 Hardener

11.0

3 hrs.

24 hrs.

2 hrs.

- - -

Ancamine Z

7.8

8 hrs.

- - -

16 hrs.

4 hrs.

 

 

ROOM TEMPERATURE CURE:

 

H-1 Hardener:             Cures overnight at room temperature or 2 hours at 65’ C.

                                    Do not heat cure if the mass exceeds 200 grams.

 

H-7 Hardener:             Cures overnight at room temperature or 2 hours at 65’ C.

                                    Do not heat cure if the mass exceeds 200 grams.

 

 

HEAT CURE:

 

Ancamine Z:               Cures overnight at 65’ C or 4 hours at 125’ C. For best physical and electrical properties, a slow cure for 16 hours at 65’ C followed by a post cure for 4 hours at 125’ C is recommended.

                                                     

 

MIXING INSTRUCTIONS:

 

Mix CC3-301AD thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 5.4 grams of H-1 Hardener and 100 grams of CC3-301AD for a total mix of 105.4 grams) Mix thoroughly. Use in a well ventilated area and avoid contact with eyes and skin.

 


Cast-Coat, Inc.
354 West Street
West Bridgewater, Ma 02379
800-527-4502 Toll Free
508.587.4502 Phone
508.587.4514 Fax

 

 

 

 

 

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