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CC3-341  

 

 

Thermally Conductive, Thin Glue Line Adhesive

 

 

CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as .001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65’ C to 155’ C. When cured, CC3-341 is not adversely affected by moisture, humidity or saly spray, and will withstand repeated cycling through a wave solder machine.

 

 

ELECTRICAL AND PHYSICAL PROPERTIES:    
  Specific Gravity @ 25’ C 1.6 to 1.7  
  Viscosity @ 25’ C, cps, (uncatalyzed) 18,000 to 22,000  
  Standard Color   Black  
  Shelf Life  12 months  
  Tensile Strength @ 25’ C, psi  8,298  
  Tensile Elongation: % @ yield 1.7 to 1.9  
  Compressive Strength @ 25’ C, psi 23,400  
  Izod Impact: ft lbs/in of notch   0.25  
  Heat Distortion: ‘C  145  
  Water Absorption: %, 10 days @ 25’ C 0.2  
  Linear Shrinkage: in/in  0.0025  
  Service Temperature, ‘C continuous -65 to +125  
  Service Temperature, ‘C intermittent -100 to +160  
  Hardness: Shore D   88 to 94  
  Bond Shear Strength: al to al 1” overlap @ 25’ C, psi  3,840  
  Thermal Conductivity: BTU/ft2/hr/'F/in  7.7  
  Thermal Resistence: ‘C in/watt 35.6  
  Coefficient of Thermal Expansion: in/in/’C x 10-6    26  
  Volume Resistivity @ 25’ C, ohm-cm 1016  
  Dielectric Constant @ 25’ C, 100 KC 5.7  
  Dissipation Factor @ 25’ C, 100 KC 0.02  
  Dielectric Strength: .003” sample, volts/mil  300 - 350  
       
 
( Typical properties when cured with H-1 Hardener )
   

                            

 

CC3-341

 

 

CHOICE OF HARDENERS:

 

H-1 Hardener:                         Rigid, good dimensional stability, fast cure.

 

H-7 Hardener:                         Resilient, excellent mechanical and thermal shock, low viscosity,

good air release, fast cure.

 

Ancamine Z:                           Resilient, excellent mechanical and thermal shock, plus high heat

distortion, long pot life.

 

 

HARDENER

PARTS BY WEIGHT
PER 100 PARTS OF RESIN

POT LIFE
100 GRAM
25'C (77'F)

CURE TIME
25' C
(77'F)

CURE TIME
65' C
(149' F)

CURE TIME
125 ' C
(257 ' F)

H-1 Hardener

6.4

2 hrs.

24 hrs.

2 hrs.

- - -

H-7 Hardener

13.3

3 hrs.

24 hrs.

2 hrs.

- - -

Ancamine Z

9.4

8 hrs.

- - -

16 hrs.

4 hrs.

 

 

ROOM TEMPERATURE CURE:

 

H-1 Hardener:                         Cures overnight at room temperature or 2 hrs at 65’ C.

Do not heat cure if the mass exceeds 200 grams.

 

H-7 Hardener:                         Cures overnight at room temperature or 2 hrs at 65’ C.

                                               

 

HEAT CURE:

 

Ancamine Z:                           Cures overnight at 65’ C or 4 hrs at 125’ C. For best physical and electrical properties, a slow cure for 16 hours at 65’ C followed by a post cure for 4 hours at 125’ C is recommended.

 

 

MIXING INSTRUCTIONS:

 

Mix CC3-341 thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 6.4 grams of H-1 Hardener and 100 grams of CC3-341 for a total mix of 106.4 grams) Mix thoroughly. Evacuate the mix for 5 to 15 minutes in order to insure a void free glue line. Apply to both mating surfaces. Work the sufaces together, squeezing out the excess adhesive in order to obtain a thin bond line. The parts should be held securely in place with moderate pressure to prevent movement during cure. Use in a well ventilated area and avoid contact with eyes and skin.

   

 

Cast-Coat, Inc.
354 West Street
West Bridgewater, Ma 02379
800-527-4502 Toll Free
508.587.4502 Phone
508.587.4514 Fax