CC3-465
LIGHT WEIGHT EPOXY POTTING COMPOUND
CC3-465 ____resin was developed for the semiconductor industry as a light weight, low dielectric constant epoxy potting compound. Its low viscosity and good wetting properties enable densely packaged circuitry to be totally encapsulated, void-free without the aid of a vacuum in most cases. The hollow glass microspheres increase its structural strength and electrical insulation while reducing shrinkage and thermal conductivity.
CC3-465 ____is easy to use and is readily adaptable to automatic machine dispensing. It cures at room temperature or with heat and meets most military and UL flame retardant requirements.
SPECIFICATIONS:
| UNCURED | ||
| Specific Gravity @ 25'C | 0.77 | |
| Viscosity @ 25'C, cps (uncatalyzed) | 3000 | |
| Standard Color | Black | |
| Shell Life (months from manufacture date) | 12 | |
| PHYSICAL PROPERTIES | ||
| Tensile Strength @ 25'C psi | 4545 | |
| Tensile Elongation % @ yield | 2.0 - 3.0 | |
| Compressive Strength @ 25'C psi | 10,300 | |
| Izod Impact, ft lbs/in of notch | 0.21 | |
| Heat Distortion, 'C | 130 | |
| Water Absorption, 10 days @ 25'C, % | 0.25 | |
| Linear Shrinkage, in/in | 0.005 | |
| Service Temperature, 'C continuous | -65 to 130 | |
| Service Temperature, 'C intermittent | -100 to 200 | |
| Hardness, Shore D | 75 - 80 | |
| THERMAL PROPERTIES | ||
| Thermal Conductivity, cal/sec/cm2/'C/cm x 10-4 | 3.0 | |
| Thermal Conductivity, BTU/ft2/hr/'F/in | 1.1 | |
| Thermal Resistance | 248 | |
| Coefficient of Thermal Expansion, in/in/'C x 10-6 | 39 | |
| ELECTRICAL PROPERTIES | ||
| Volume Resistivity @ 25'C, ohm-cm | l0 l4 | |
| Dielectric Constant @ 25'C, 100 KC | 1.9 | |
| Dissipation Factor @ 25'C, 100 KC | 0.003 | |
| Dielectric Strength, volts/mil | 350 - 500 |
MIXING INSTRUCTIONS:
Stir CC3-465 in its shipping container to insure a uniform dispersion of the filler. The use of power mixing equipment is recommended only if used at low speed to avoid breaking the glass bubble filler. Weigh out the desired amount of compound in a clean container and add 22.5 parts of H-7 hardener or 18 parts of H-16 hardener per 100 parts of CC3-465. Mix thoroughly. Vacuum can be used to remove entrapped air prior to pouring. Use in a well ventilated area and avoid breathing fumes or contact with eyes and skin.
CURE SCHEDULE:
When curing more than 100 grams of concentrated mass, allow to cure overnight at room temperature. Quantities of less than loo grams can be cured more rapidly with heat up to 150'C.
Each application is different. It is advisable to run a sample through an oven at the temperature of your choice. Check to see how long it takes to harden and be sure the resin did not boil or exotherm before it cured.
(508) 587-4502 FAX (508) 587-4514
354 WEST STREET W. BRIDGEWATER, MA 02379