CC3-301AD
THERMALLY CONDUCTIVE, LOW VISCOSITY POTTING RESIN
CC3-301AD is a low viscosity version of CC3-301. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting; providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. Its high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD have shown good resistance to cracking under severe temperature cycling. Unlike CC3-301, the filler used in CC3-301AD may settle out during storage. It is very important to stir the material in the shipping container prior to use.
CC3-301AD meets MIL T-27, Grade 5, Class S; MIL STD. 202.111, FED TEST METHOD STD. 406-2021; and MIL 1-16923, Types C and D.
TYPICAL APPLICATIONS
Densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, delay lines, oscillators, minidac, operational amplifiers, binary devices, relays, transformers and semiconductors.
| ELECTRICAL AND PHYSICAL PROPERTIES | ||
| Specific Gravity: @ 25' C | 1.9 - 2.1 | |
| Viscosity: @ 25'C, cps (catalyzed) | 1,500 - 2,000 | |
Thermal Conductivity: BTU/ft -hr-'F/in |
8.9 | |
| Tensile Strength: @ 25'C psi | 7,800 | |
| Compressive Strength: @ 25'C psi | 19,000 | |
| Izod Impact: ft lbs/in of notch | 0.49 | |
Coefficient of Thermal Expansion: in/in/'C
x 10 |
28 | |
| Heat Distortion: ' C | 65 | |
| Water Absorption: 7 days @ 25'C, % | 0.3 | |
| Volume Resistivity: @ 25'C, ohm-cm | l0 |
|
| Dielectric Constant: @ 25'C, 100 KC | 5.6 | |
| Dissipation Factor: @ 25'C, 100 KC | 0.02 | |
| Dielectric Strength: volts/mil | 600 | |
| Linear Shrinkage: in/in | 0.003 | |
| Service Temperature: 'C continuous | -65 to 150 | |
| Standard Color | Black | |
(Typical properties when cured with H-7)
| CHOICE OF HARDENERS: |
|
| H-1 HARDENER |
- rigid, good dimensional
stability, fast cure. |
| H-7 HARDENER |
- resilient, excellent
mechanical and thermal shock, low viscosity, good air release, fast cure. |
| H-34 HARDENER |
- resilient, excellent mechanical and thermal shock, plus high heat distortion, long pot life. |
|
HARDENER
|
PARTS BY WEIGHT |
POT LIFE |
CURE TIME
25 ' C (77 ' F) |
CURE TIME
65 ' C (149 ' F) |
CURE TIME
125 ' C (257 ' F) |
|
H-1
|
5.4
|
2 hrs.
|
24 hrs.
|
2 hrs.
|
---
|
|
H-7
|
11.0
|
3 hrs.
|
24 hrs.
|
2 hrs.
|
---
|
|
H-34
|
7.8
|
8 hrs.
|
---
|
16 hrs.
|
4 hrs.
|
ROOM TEMPERATURE CURE
|
H-1 HARDENER |
- Cures overnight
at room temperature or 2 hrs. at 65'C. Do not heat cure if the _mass exceeds 200 grams. |
| H-7 HARDENER |
- Cures overnight
at room temperature or 2 hrs. at 65'C. Do not heat cure if the _mass exceeds 200 grams. |
| HEAT CURE |
|
| H-34 HARDENER |
- Cures over night
at 65'C or 4 hours at 125'C. For the best physical and electrical properties, a slow cure for 16 hours at 65'C followed by a post cure for 4 hours at 125'C is recommended. |
MIXING INSTRUCTIONS
Mix CC3-301AD thoroughly in its shipping container to insure uniform consistency. Weigh out the desired amount of resin in a clean container and add the hardener accurately by weight in the proper proportion as specified above. Mix thoroughly.
Use in a well ventilated area and avoid breathing fumes or contact with eyes and skin.
(508) 587-4502 FAX (508) 587-4514
354 WEST STREET W. BRIDGEWATER, MA 02379