
CC3-301AD-FR
UL-94V-0 FIRE RETARDANT
THERMALLY CONDUCTIVE, LOW VISCOSITY POTTING RESIN
CC3-301AD-FR is a fire retardant version of CC3-301AD. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting; providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. Its high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD-FR have shown good resistance to cracking under severe temperature cycling. The filler used in CC3-301AD-FR may settle out during storage. It is very important to stir the material in the shipping container prior to use.
CC3-301AD-FR meets MIL T-27, Grade 5, Class H; MIL STD. 202.111, FED TEST METHOD STD. 406-2021; MIL 1-16923, Types C and D; and UL-94V-0.
TYPICAL APPLICATIONS
Densely packaged power
supplies, integrated circuits, thick film hybrid devices, D/A converters, delay
lines, oscillators, minidac, operational amplifiers, binary devices, relays,
transformers and semiconductors.
| ELECTRICAL AND PHYSICAL PROPERTIES | ||
| Specific Gravity: @ 25'C | 1.6 - 1.7 | |
| Viscosity: @ 25'C, cps (catalyzed) | 1,500 - 2,000 | |
| Thermal Conductivity:
BTU/ft |
9.0 | |
| Tensile Strength: @ 25'C psi | 7,800 | |
| Compressive Strength: @ 25'C psi | 24,000 | |
| Izod Impact: ft lbs/in of notch | 0.9 | |
| Coefficient of
Thermal Expansion: in/in/'C x 10 |
26 | |
| Heat Distortion: 'C | 65 | |
| Water Absorption: 7 days @ 25'C, % | 0.29 | |
| Volume Resistivity: @ 25'C, ohm-cm | 10 |
|
| Dielectric Constant: @ 25'C, 100 KC | 5.6 | |
| Dissipation Factor: @ 25'C, 100 KC | 0.02 | |
| Dielectric Strength: volts/mil | 500 | |
| Linear Shrinkage: in/in | 0.003 | |
| Service Temperature: 'C continuous | -65 to 155 | |
| Standard Color | Black | |
CHOICE OF HARDENERS
| H-1 HARDENER |
- rigid, good dimensional stability, fast cure. |
| H-7 HARDENER |
- resilient, excellent
mechanical and thermal shock, low viscosity, good air release, fast cure. |
H-34 HARDENER |
- resilient, excellent
mechanical and thermal shock, plus high heat distortion, long pot life. |
| H-lOLV HARDENER | - variable hardness, excellent impact properties, long pot life. |
|
HARDENER
|
PARTS BY WEIGHT
PER 100 PARTS OF RESIN |
POT LIFE
100 GRAM 25 ' C (77 ' F) |
CURE TIME
25 ' C (77 ' F) |
CURE TIME
65 ' C (149 ' F) |
CURE TIME
125 ' C (257 ' F) |
|
H-1
|
5.6
|
2 hrs.
|
24 hrs.
|
2 hrs.
|
---
|
|
H-7
|
11.5
|
3 hrs.
|
24 hrs.
|
2 hrs.
|
---
|
|
H-34
|
8.1
|
8 hrs.
|
---
|
16 hrs.
|
4 hrs.
|
|
H-10LV
|
rigid ____________15
|
3 hrs.
|
24 hrs.
|
3 hrs.
|
---
|
|
H-10LV
|
semi - flex ________35
|
3 hrs
|
24 hrs.
|
3 hrs
|
---
|
|
H-10LV
|
flexible ___________50
|
3 hrs.
|
24 hrs.
|
3 hrs.
|
---
|
ROOM TEMPERATURE CURE
| H-1 HARDENER |
- Cures overnight
at room temperature or 2 hours at 65'C. Do not heat cure if the mass exceeds 200 grams. |
| H-7 HARDENER |
- Cures overnight
at room temperature or 2 hours at 65'C. |
| H-lOLV HARDENER |
- Cures overnight
at room temperature or 3 hours at 65'C. |
| HEAT CURE |
|
| H-34 HARDENER |
- Cures over night
at 65'C or 4 hours at 125'C. For the best physical and electrical properties, a slow cure for 16 hours at 65'C followed by a post cure for 4 hours at 125'C is recommended. |
MIXING INSTRUCTIONS
Mix CC3-301AD-FR thoroughly in its shipping container to insure a uniform consistency. Weigh out the required amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. Mix thoroughly.
Use in a well ventilated area and
avoid contact with eyes and skin.
(508) 587-4502 FAX (508) 587-4514
354 WEST STREET W. BRIDGEWATER, MA 02379