CC3-341
THERMALLY CONDUCTIVE, THIN GLUE LINE ADHESIVE
CC3-341 was developed as a thin glue-line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation.
Glue lines as thin as .001" can be easily achieved while still maintaining a strong bond over a wide temperature range of -65'C to 155'C. When cured, CC3-341 is not adversely effected by moisture, humidity, or salt spray, and will withstand repeated cycling through a wave solder machine.
| ELECTRICAL and PHYSICAL PROPERTIES | ||
| Specific Gravity: @ 25'C | 1.6 - 1.7 | |
| Viscosity: @ 25'C, cps (uncatalyzed) | 18,000 - 22,000 | |
| Standard Color | Black | |
| Shelf Life: (months from manufacture date) | 12 | |
| Tensile Strength: @ 25'C psi | 8,340 | |
| Tensile Elongation: % @ yield | 1.8 - 2.0 | |
| Compressive Strength: @ 25'C psi | 24,500 | |
| Izod Impact: ft lbs/in of notch | 0.35 | |
| Heat Distortion: 'C | 155 | |
| Water Absorption: 10 days @ 25 ' C, % | 0.2 | |
| Linear Shrinkag:, in/in | 0.0025 | |
| Service Temperature: 'C continuous | -65 to 155 | |
| Service Temperature: 'C intermittent | -100 to 330 | |
| Hardness: Shore D | 80 - 90 | |
| Bond Shear Strength: | ||
| __________aluminum to aluminum 1" overlap: @ 25'C psi | 3,750 | |
Thermal Conductivity: BTU/ft -hr-'F/in |
7.7 | |
| Thermal Resistance: 'C in/watt | 35.6 | |
Coefficient of Thermal Expansion: in/in/'C
x 10 |
25 | |
| Volume Resistivity: @ 25'C, ohm-cm | 10 |
|
| Dielectric Constant: @ 25'C, 100 KC | 5.7 | |
| Dissipation Factor: @ 25'C, 100 KC | 0.02 | |
| Dielectric Strength: .003" thickness volts/mil | 1,000 - 2,000 | |
CHOICE OF HARDENERS
| H-1 HARDENER |
- rigid, good dimensional
stability, fast cure. |
| H-7 HARDENER |
- resilient, excellent
mechanical and thermal shock, low viscosity, good air release, fast cure. |
H-34 HARDENER |
- resilient, excellent
mechanical and thermal shock, plus high heat distortion, long pot life. |
|
HARDENER
|
PARTS BY WEIGHT
PER 100 PARTS OF RESIN |
POT LIFE
100 GRAM 25 ' C (77 ' F) |
CURE TIME |
CURE TIME
65 ' C (149 ' F) |
CURE TIME
125 ' C (257 ' F) |
|
H-1
|
6.4
|
2 hrs.
|
24 hrs.
|
2 hrs.
|
---
|
|
H-7
|
13.3
|
3 hrs.
|
24 hrs.
|
2 hrs.
|
---
|
|
H-34
|
9.4
|
8 hrs.
|
---
|
16 hrs.
|
4 hrs.
|
ROOM TEMPERATURE CURE
| H-1 HARDENER |
- Cures overnight at room temperature or 2 hrs at
65'C. Do not heat cure if the |
| H-7 HARDENER | - Cures overnight at room temperature or 2 hrs at 65'C. |
HEAT CURE
| H-34 HARDENER |
- Cures overnight at 65'C or 4 hrs at 125'C.
For best physical and electrical properties, a slow cure for 16 hrs at 65'C followed by a post cure for 4 hrs at 125'C is recommended. |
MIXING INSTRUCTIONS
Mix CC3-341 thoroughly in its shipping container to insure a uniform consistency. Weigh out the required amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. Mix thoroughly.
Evacuate the mix for 5 to 15 minutes in order to insure a void free glue line. Apply to both mating surfaces. Work the surfaces together, squeezing out the excess adhesive in order to obtain a thin bond line. The parts should be held securely in place with moderate pressure to prevent movement during cure.
Use in a well ventilated area and avoid contact with eyes and skin.
(508) 587-4502 FAX (508) 587-4514
354 WEST STREET W. BRIDGEWATER, MA 02379